Liquid encapsulant fill material specifically designed to offer efficient light transmission & low cure stress. 100% solids, unfilled, liquid encapsulant designed for encapsulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organic. UV or thermally curable.

MSDS / Technical Data Sheets / Product Literature

• dataData Sheet #668
• litHigh Performance Adhesives

產品留言

標題

聯系人

聯系電話

內容

驗證碼

點擊換一張

注：1.可以使用快捷鍵Alt+S或Ctrl+Enter發送信息!
2.如有必要,請您留下您的詳細聯系方式!